軟性印刷電路板簡介

1、軟性印刷電路板簡介IntroductiontoFLEXIBLEPRINTEDCIRCUIT目錄1.軟板簡介.................................12.基本材料.................................13.常用單位.................................24.軟板製程.................................24.1.一般流程.....

2、........................24.2.鑽孔.................................34.3.黑孔鍍銅............................44.4.壓膜曝光............................64.5.顯影蝕刻剝膜.......................84.6.微蝕.................................84.7.CVL

3、假接著壓合.......................94.8.沖孔.................................94.9.鍍錫鉛...............................94.10.....................................水平噴錫94.11.....................................印刷104.12.................

4、....................沖型104.13.....................................電測101.軟板(FLEXIBLEPRINTEDCIRCUIT)簡介以俱撓性之基材製成之印刷電路板具有體積小重量輕可做3D立體膠一般有Acrylic膠及Expoxy膠兩種最常使用Expoxy膠厚度上由0.4~1mil均有一般使用1mil膠厚2.2.覆蓋膜Coverlay覆蓋膜由基材膠組合而成其基材亦區(qū)分為PI

5、與PET兩種視銅箔基材之材質(zhì)選用搭配之覆蓋膜覆蓋膜之膠亦與銅箔基材之膠相同厚度則由0.5~1.4mil2.3.補強材料Stiffener軟板上局部區(qū)域為了焊接零件或增加補強以便安裝而另外壓合上去之硬質(zhì)材料2.3.1.補強膠片區(qū)分為PI及PET兩種材質(zhì)4.2.鑽孔NCDrilling雙面板為使上下線路導(dǎo)通以鍍通孔方式先鑽孔以利後續(xù)鍍銅4.2.1.鑽孔程式編碼銅箔基材鑽孔程式B40NNNRR400(300)銅箔基材品料號末三碼版別程式格式(