自動(dòng)化專業(yè)外文翻譯----基于嵌入式處理器的vlsi芯片的溫度自動(dòng)控制

1、<p><b>　　畢業(yè)設(shè)計(jì)/論文</b></p><p>　　外 文 文 獻(xiàn) 翻 譯</p><p>　　系　 別 自動(dòng)化 </p><p>　　專 業(yè) 班 級 自動(dòng)化 0601 </p><p>　　姓　 名

2、 </p><p>　　評 分 </p><p>　　指 導(dǎo) 教 師 </p><p>　　畢業(yè)設(shè)計(jì)/論文外文文獻(xiàn)翻譯要求：</p><p>　　1．外文文獻(xiàn)翻譯的內(nèi)容應(yīng)與畢業(yè)

3、設(shè)計(jì)/論文課題相關(guān)。</p><p>　　2．外文文獻(xiàn)翻譯的字?jǐn)?shù)：非英語專業(yè)學(xué)生應(yīng)完成與畢業(yè)設(shè)計(jì)/論文課題內(nèi)容相關(guān)的不少于2000漢字的外文文獻(xiàn)翻譯任務(wù)（其中，漢語言文學(xué)專業(yè)、藝術(shù)類專業(yè)不作要求），英語專業(yè)學(xué)生應(yīng)完成不少于2000漢字的二外文獻(xiàn)翻譯任務(wù)。格式按《華中科技大學(xué)武昌分校本科畢業(yè)設(shè)計(jì)/論文撰寫規(guī)范》的要求撰寫。</p><p>　　3．外文文獻(xiàn)翻譯附于開題報(bào)告之后：第一部分為譯文

4、，第二部分為外文文獻(xiàn)原文，譯文與原文均需單獨(dú)編制頁碼（底端居中）并注明出處。本附件為封面，封面上不得出現(xiàn)頁碼。</p><p>　　4．外文文獻(xiàn)翻譯原文由指導(dǎo)教師指定，同一指導(dǎo)教師指導(dǎo)的學(xué)生不得選用相同的外文原文。</p><p>　　基于嵌入式處理器的VLSI芯片的溫度自動(dòng)控制</p><p><b>　　摘要</b></p>

5、<p>　　本文介紹了基于嵌入式處理器的VLSI芯片的溫度自動(dòng)控制，同時(shí)利用溫度傳感器LM35和ARM處理器LPC2378來完成設(shè)計(jì)。由于VLSI芯片密度非常高，同時(shí)芯片在工作時(shí)很快得到加熱，如果不能研制出能是它快速冷卻的方法，芯片的性能將會受到很大影響。在目前的工作中，將傳感器放置在非常接近接近到IC集成電路的位置來采集芯片的溫度，通過由ARM處理器產(chǎn)生的PWM信號來控制集成電路旁風(fēng)扇的轉(zhuǎn)速。在硬件電路中也提供了一個(gè)蜂鳴器，

6、在無法控制風(fēng)扇或者IC集成電路的過熱的情況下都會發(fā)出警報(bào)。整個(gè)過程的實(shí)現(xiàn)需要制定一個(gè)合適的嵌入式C程序。</p><p>　　關(guān)鍵詞：溫度傳感器，ARM處理器，超大規(guī)模集成電路芯片，無刷直流電動(dòng)機(jī)</p><p><b>　　1.介紹 </b></p><p>　　隨著VLSI超大規(guī)模集成電路技術(shù)的驚人發(fā)展，雄心勃勃的IC設(shè)計(jì)師正試圖將更多的晶

7、體管用更小的體積實(shí)現(xiàn)更多的功能。因此，該集成電路運(yùn)行速度更快，產(chǎn)生更多的熱量而造成的新的問題。舉例來說，現(xiàn)在世界上的的CPU芯片 變得越來越小，幾乎沒有空間散熱。若消耗100 W的功率的話，峰值功率密度為400-500 W/Cm2，并可能持續(xù)上升。隨著芯片溫度的升高會影響性能的參數(shù)變化，從而減少芯片的工作頻率和影響時(shí)序的規(guī)范。因此，在允許的條件范圍內(nèi)，為了讓高速芯片能得到最好的工作效率和最長的運(yùn)行時(shí)間，必須要讓芯片在短時(shí)間內(nèi)冷卻下來。高

8、速芯片所能允許的最高溫度，取決于程序的參數(shù)規(guī)格，以及芯片的設(shè)計(jì)。 在各種不同的冷卻技術(shù)中，人們通常使用散熱片，熱管，風(fēng)扇以及時(shí)鐘節(jié)流。在這些技術(shù)中，風(fēng)扇可以快速高效的降低高速芯片的溫度，但它們也產(chǎn)生大量的噪音。這種噪聲可以通過不同的方法來降低，根據(jù)風(fēng)扇轉(zhuǎn)速是由溫度來控制，當(dāng)溫度低時(shí)，風(fēng)扇的轉(zhuǎn)速降低；隨著溫度的提高，風(fēng)扇的速度會隨著提升。另一個(gè)有效地的方法是時(shí)鐘節(jié)流，即減少了時(shí)鐘速度，降低功耗。但它也降低了系統(tǒng)性能和系統(tǒng)運(yùn)行速度

9、。本工作的目標(biāo)是，設(shè)計(jì)一個(gè)硬件系統(tǒng)能控制</p><p>　　LM35系列是精密的集成電路溫度傳感器，其輸出電壓與采集到的攝氏的溫度成線性比。因此，LM35系列比一般的傳感器擁有優(yōu)勢，因?yàn)槲覀兛梢灾苯油ㄟ^電壓值來確定攝氏溫度值。LM35不需要校準(zhǔn)或微調(diào)，便可以提供提供在室溫±0.25 ℃ 精度和-55 ℃ ~ +150℃溫度范圍。由于LM35系列不需要校準(zhǔn)，所以該傳感器比較經(jīng)濟(jì)，低成本。LM35的低輸出

10、阻抗，線性輸出和精確的校準(zhǔn)的特點(diǎn)使固有接口的讀數(shù)和控制電路特別容易。它同時(shí)可用于單電源輸出和多電源輸出。由于它只需要60微安的電流供應(yīng)，所以它自身產(chǎn)生的熱量較低，在真空中約升溫0.1 ℃。LM35 在-55 ℃ ~ +150℃溫度范圍內(nèi)可以正常的工作，而LM35C可工作的溫度范圍為-40 ℃ ~ +110℃。LM35系列可封裝在密封的TO - 46晶體管內(nèi)，而LM35C，LM35CA和LM35D也可用塑膠TO-92晶體管封裝。LM35D

11、也可以用8引腳小型封裝和塑料的TO - 220封裝。由ARM7TDMI處理器所產(chǎn)生的PWM信號來控制直流風(fēng)扇電動(dòng)機(jī)兩端的電壓。PWM信號的變化與LM35溫度傳感器的電壓輸出同步。因此，這整個(gè)項(xiàng)目的重要組成部分是溫度傳</p><p><b>　　2 描述 </b></p><p>　　在ARM處理器為基礎(chǔ)的溫度自動(dòng)控制系統(tǒng)，溫度傳感器輸出是由芯ADC來控制。而ADC的

12、輸出是與IC相連，IC L293D的驅(qū)動(dòng)信號直接送到直流風(fēng)扇電機(jī)中，系統(tǒng)框圖如圖1所示。LCD圖形液晶顯示器（128x64像素）的接口與ARM LPC 2378處理器相連，來顯示該集成電路的溫度和風(fēng)扇轉(zhuǎn)速。蜂鳴器同樣是連接ARM處理器，在無法控制風(fēng)扇和芯片過熱的情況下會發(fā)出警報(bào)，整個(gè)電路圖如圖2所示。 </p><p><b>　　圖1 系統(tǒng)框圖</b></p><p&

13、gt;<b>　　圖2電路圖</b></p><p><b>　　3 軟件介紹 </b></p><p>　　目前的工作是使用ARM IAR工作臺IDE，嵌入式C程序和使用Flash ISP工具處理器進(jìn)行嵌入式開發(fā)。ARM IAR的工作臺IDE是一個(gè)非常強(qiáng)大的集成開發(fā)環(huán)境（IDE），允許開發(fā)和管理完整的嵌入式應(yīng)用項(xiàng)目。在系統(tǒng)編程這一環(huán)境下我們可以

14、采用引導(dǎo)加載器軟件和使用一個(gè)串行端口進(jìn)行編程或重新編程閃存記憶體中的程序。LPC2387單片機(jī)是基于16/32位的ARM7TDMI-S CPU的實(shí)時(shí)仿真，它同時(shí)結(jié)合了512 kB嵌入式閃存單片機(jī)的特點(diǎn)。128位寬度的存儲器接口和獨(dú)特的加速結(jié)構(gòu)使32位代碼執(zhí)行在最大時(shí)鐘頻率下運(yùn)行。在Thumb模式下，中斷服務(wù)程序和DSP算法的關(guān)鍵性能能提高30％以上。對于重要代碼應(yīng)用，其他16位代碼在Thumb模式性能損失可減少超過30％。LPC2387

15、是多用途串行通信應(yīng)用的理想選擇。它由一10/100以太網(wǎng)媒體訪問控制器（MAC），4個(gè)端點(diǎn)的USB全速設(shè)備內(nèi)存，4個(gè)UART，兩個(gè)CAN通道，一個(gè)SPI接口，兩個(gè)同步串行端口（SSP）的，3 個(gè)I2C接口，和一個(gè)I2S接口組成。這種融合了串行通信接口與頻率為4 MHz內(nèi)部振蕩器，64 KB的SRAM記憶體，16個(gè)以太網(wǎng)，</p><p><b>　　4 結(jié)果與結(jié)論 </b></p>

16、;<p>　　基于嵌入式ARM處理器的溫度控制系統(tǒng)的設(shè)計(jì)和實(shí)施已經(jīng)完成了。為了驗(yàn)證設(shè)計(jì)的有效性，溫度傳感器被放在一個(gè)比室內(nèi)溫度高的烤箱內(nèi)。這時(shí)風(fēng)扇在全速運(yùn)行并發(fā)現(xiàn)溫度重返正常溫度。我們重復(fù)的用各種不同的超大規(guī)模集成電路來做這個(gè)實(shí)驗(yàn)，像奔騰處理器芯片，F(xiàn)PGA芯片等。我們將溫度傳感器放在接近奔騰處理器的計(jì)算機(jī)的位置，慢慢的我們觀察到風(fēng)扇的速度自動(dòng)增加，芯片的溫度被控制。這些結(jié)果在LCD液晶顯示面板上可以看見。雖然目前的系統(tǒng)在

17、特定環(huán)境下是行之有效的，但以下結(jié)論仍然是值得強(qiáng)調(diào)。 一般情況下，使用控制風(fēng)扇速度或時(shí)鐘節(jié)流的方式來控制溫度的條件是必須及時(shí)的檢測出目標(biāo)芯片的溫度。這個(gè)實(shí)驗(yàn)中通過放置一個(gè)溫度傳感器在目標(biāo)芯片旁邊，在某些情況下，也可以放在被測物體下方或者是散熱器下。以這種方式檢測高速芯片的溫度與實(shí)際溫度較為接近，但也有可能測量溫度比管芯溫度上升時(shí)溫度要低。因此，電路板或散熱片溫度和高速芯片管芯的溫度必須相關(guān)。當(dāng)然如果有很多高速芯片是更好的選擇。許

18、多CPU，F(xiàn)PGA和其他高速集成電路包含一個(gè)熱二極管，其實(shí)是一個(gè)連接雙極晶體管的二極管。使用遠(yuǎn)程二極管溫度傳感器連接到這個(gè)熱二極管，得出的結(jié)果可以與</p><p>　　在一些系統(tǒng)中，限制風(fēng)扇的速度變化率也是重要的。如果該系統(tǒng)與用戶接近的話這一點(diǎn)是很關(guān)鍵的。在某些環(huán)境中，只需切換風(fēng)扇的開關(guān)或改變速度可以讓溫度變化。但是，當(dāng)用戶在系統(tǒng)附近時(shí)，在風(fēng)扇的速度的突然變化會產(chǎn)生非常惱人的噪音。因此，為了避免這些影響，風(fēng)扇的

19、驅(qū)動(dòng)器信號必須限制在一個(gè)可接受范圍內(nèi)。</p><p>　　5.未來的工作前景 </p><p>　　在目前的工作溫度是由溫度傳感器LM35來采集，電機(jī)的轉(zhuǎn)速是通過改變控制的處理器產(chǎn)生的PWM脈寬來控制。但LM35溫度傳感器并不能做到非常精確地采集溫度，即使我們讓LM35溫度傳感器非常接近集成電路處理器或 VLSI芯片。因此，我們可以使用一個(gè)遠(yuǎn)程二極管溫度傳感器連接到熱二極管，這種措施的直

20、接測出高速集成電路的溫度，檢測出的結(jié)果非常精確。</p><p>　　另一個(gè)重要方面是各種傳感器的遠(yuǎn)程溫度高達(dá)五個(gè)傳感渠道，可以將檢測到的高速芯片的溫度數(shù)據(jù)傳送到微控制器。風(fēng)扇轉(zhuǎn)速的監(jiān)測與多渠道風(fēng)扇轉(zhuǎn)速調(diào)節(jié)器可以有效的控制溫度。外部微控制器的命令可提供可靠的控制電源電壓來監(jiān)測風(fēng)扇轉(zhuǎn)速與調(diào)節(jié)多渠道風(fēng)扇轉(zhuǎn)速。</p><p>　　對于這個(gè)簡單的由MAXIM MAX6660和MAX6653組成的

21、集成電路。第一個(gè)IC可以檢測到遠(yuǎn)程溫度然后通過溫度來控制風(fēng)扇風(fēng)速。它由內(nèi)部晶體管產(chǎn)生一個(gè)直流電源電壓給風(fēng)扇供電。第二個(gè)IC也執(zhí)行類似的功能，但驅(qū)動(dòng)器由外部晶體管產(chǎn)生PWM波形。兩個(gè)集成電路都包含完整的熱故障監(jiān)測系統(tǒng)，如果高速芯片太熱，系統(tǒng)會自動(dòng)關(guān)閉。因此，目前的工作可以使用上述技術(shù)進(jìn)一步提高。</p><p>　　原文出處：By:Narasimha Murthy Yayavaram;Saritha Chappid

22、i;Sukany Velamakuri.Sensors & Transducers Journal,2009,Vol.100, No.1</p><p>　　Embedded Processor Based Automatic Temperature Control of VLSI Chips</p><p><b>　　Abstract</b></p&

23、gt;<p>　　This paper presents embedded processor based automatic temperature control of VLSI chips, using temperature sensor LM35 and ARM processor LPC2378. Due to the very high packing density, VLSI chips get heat

24、ed very soon and if not cooled properly, the performance is very much affected. In the present work, the sensor which is kept very near proximity to the IC will sense the temperature and the speed of the fan arranged nea

25、r to the IC is controlled based on the PWM signal generated by the ARM proce</p><p>　　Keywords: Temperature sensor, ARM processor, VLSI chips, Brushless DC motor</p><p>　　1.Introduction</p>

26、;<p>　　With the phenomenal developments in VLSI technology, the ambitious IC designers are trying to put more transistors in to smaller packages. So, the ICs run at higher speeds and produce large amount of heat w

27、hich creates the problem of thermal management. For example, nowadays the CPU chips are becoming smaller and smaller with almost no room for the heat to escape. The total power dissipation levels now reside on the order

28、of 100 W with a peak power density of 400-500 W/Cm2, and are still steadil</p><p>　　As the chip temperature increases its performance is very much degraded by parameters shift, decrease in operating frequenc

29、ies and out-of specification of timings. So the high speed chips must be cooled to maintain good performance for the longest possible operating time and over the widest possible range of environmental conditions. The max

30、imum allowable temperature for a high speed chip to meet its parametric specifications depends on the process and how the chip is designed.</p><p>　　Among the various cooling techniques, heat sinks, heat pip

31、es, fans and clock throttling are usually employed. Among these techniques, fans can dramatically reduce the temperature of a high speed chip,but they also generate a great deal of acoustic noise. This noise can be reduc

32、ed significantly by varying ,the fans speed based on temperature i.e. the fan can turn slowly when the temperature is low and canspeed up as the temperature increases.The other prominent method is clock throttling i.e. r

33、ed</p><p>　　2. Description</p><p>　　In ARM processor based automatic temperature control system, the output of the temperature sensor is fed to the on chip ADC and the output of the ADC is given

34、 to the L293D driver IC which in turn is fed to DC motor fan as shown in the block diagram in Fig. 1. A graphic LCD (128x64 pixels) is interfacedto the ARM LPC 2378 processor to display the temperature of the IC and the

35、speed of the fan. A buzzer is also connected to the processor which gives an indication, in case of the failure of the fan</p><p>　　Fig. 1. Block diagram.</p><p>　　Fig. 2. Circuit Diagram.</p

36、><p>　　3. Software Description</p><p>　　The present work is implemented using ARM IAR Workbench IDE and the necessary embedded C program is developed and dumped into the embedded processor using Fl

37、ash magic ISP Utility. The ARM IAR Workbench IDE is a very powerful Integrated Development Environment (IDE) that allows you to develop and manage complete embedded application projects. In-System Programming is programm

38、ing or reprogramming the on-chip flash memory, using the boot-loader software and a serial port. The LPC2387 microcontrolle</p><p>　　A 128-bit wide memory interface and unique accelerator architecture enable

39、 32-bit code execution at the maximum clock rate. For critical performance in interrupt service routines and DSP algorithms, this increases performance up to 30 % over Thumb mode. For critical code size applications, the

40、 alternative 16-bit Thumb mode reduces code by more than 30 % with minimal performance penalty.The LPC2387 is ideal for multi-purpose serial communication applications. It incorporates a 10/100 Ethernet Med</p>&l

41、t;p>　　The LPC2378 Microcontroller provides on-chip boot-loader software that allows programming of the internal flash memory over the serial channel. Philips provides a utility program for In-System programming called

42、 Flash magic Software.</p><p>　　4. Results and Conclusions</p><p>　　Embedded ARM processor based automatic speed control DC motor fan is designed and implemented.To test the validity of the desi

43、gn, the temperature sensor is kept inside a small oven and its temperature is increased beyond the room temperature. Now the fan is operated to run with full speed and the temperature is found to comeback to normal tempe

44、rature. This is repeated with various VLSI chips like Pentium processor, FPGA chips etc. Now the temperature sensor is kept very near to the Pentium proce</p><p>　　Normally, controlling fan speed or clock th

45、rottling based on temperature requires that the temperature of the high speed chip should be first measured. This is done by placing a temperature sensor close to the target chip either directly next to it or in some cas

46、es, under it or on the heat sink. The temperature measured in this way corresponds to that of the high speed chip, but can be significantly lower and the difference between measured temperature and the actual die tempera

47、ture increases as</p><p>　　There is also a drawback in fan speed control. Normally the fan speed is controlled by adjusting the power supply voltage of the fan. This is done by a low-frequency PWM signal, us

48、ually in the range of about 50 Hz, whose duty cycle is varied to adjust the fan’s speed. This is inexpensive and also efficient. But the disadvantage of this method is that it makes the fan somewhat nosier because of the

49、 pulsed nature of the power supply. The PWM waveforms fast edges cause the fans mechanical structure</p><p>　　In some systems, it is also important to limit the rate of change of the fan speed. This is criti

50、cal when the system is in close proximity to users. Simply switching a fan on and off or changing speed immediately as temperature changes is acceptable in some environments. But when users are in nearby, the sudden chan

51、ges in fans noise are highly annoying. So to avoid these effects the fan’s drive signal must be limited to an acceptable level.</p><p>　　5. Future Scope of the Work</p><p>　　In the present work

52、temperature is sensed using the temperature sensor LM35 and the speed of the motor is controlled by varying the width of PWM generated by the processor. But the temperature sensed by the IC LM35 is not very accurate even

53、 though we keep the IC very near to the processor orVLSI chip. So, we can use a remote diode temperature sensor connected to the thermal diode which measures the temperature of the high speed ICs directly with excellent

54、accuracy. </p><p>　　Another important aspect is a variety of remote temperature sensors with up to five sensing channels is available that can detect the die temperature of the high speed chip and transmit t

55、emperature data to a microcontroller.Fan speed regulators with multiple channels of fan tachometer monitoring can provide reliable control of fan RPM or supply voltage based on commands from an external microcontroller.

56、</p><p>　　For this simple ICs are provided by MAXIM MAX6660 and MAX6653. The first IC can sense the remote temperature and controls the fan speed based on that temperature. It produces a DC supply voltage fo

57、r the fan through an internal power transistor. The second IC also performs a similar function but drives the fan with a PWM waveform through an external pass transistor. Both include complete thermal fault monitoring wi